采用硅烷偶联剂KH-550和酚醛树脂为改性剂,先后浸渍经干燥处理后的绝缘纸,热固化后得到改性绝缘纸.通过傅里叶变换、DSC等对绝缘纸改性前后的力学性能和耐热性能进行分析.结果表明:KH-550与酚醛树脂发生了反应,引入少量的Si-O键,使改性绝缘纸的力学性能和耐热性能得到提高.改性绝缘纸的优选固化工艺为80℃/2 h+170℃/1 h.当酚醛树脂含量为30%时,改性绝缘纸的抗张强度为8.678 kN/m,伸长率为1.61%,综合性能最佳.在短期耐热性实验中,随着时间的延长,改性绝缘纸内部逐渐受到破坏,树脂开始老化变脆,改性绝缘纸的抗张强度逐渐降低,但是由于有树脂的保护,使其抗张强度的下降速率减慢,短期耐热性提高.
A modified insulating paper was perpared by impregnating silane coupling agent and phenolic resin and then thermal curing. The mechanical properties and heat resistance of the insulating paper before and after modification were analyzed by Fourier transform infrared spectoscopy (FT-IR) and DSC. The results show that the mechanical properties and heat-resistance of the modified insulating paper are improved because KH-550 would react with phenolic resin and then introduce Si-O bond. The curing process of the modified insulating paper is 80℃/2 h+170℃/1 h. When the mass percentage of phenolic resin is 30%, the modified insulating paper has the best comprehensive property with the tensile strength of 8.678 kN/m and the elongation at break of 1.61%. In the short-term heat resistance test, with the prolonging of time, the modified insulating paper was destroyed, the phenolic resin began to crosslink and became brittle, and the tensile strength of the modified insulating paper decreased. Because of the protection of phenolic resin, the decrease rate of tensile strength slows down, and the short-term heat resistance is improved.
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