根据LTCC材料的烧结温度低、高Q特性、热膨胀系数小等技术特点分析了介质料(电介质、基板、磁介质等)之间的共烧、布线金属材料与LTCC生料带的匹配、焊接材料与非焊接LTCC材料的匹配等问题,指出匹配性调制的主要方法应从异质材料的共烧致密化速率、共烧的温度制度、烧结收缩率、焊接润湿等方面综合考虑.
参考文献
| [1] | 田民波.电子封装工程[M].北京:清华大学出版社,2003 |
| [2] | Alex Beiley.Miniature filter for digital receiver[J].IEEE MTT-S Digest Part,1997(02):999. |
| [3] | Steinberg J;Kistler B.High adhesion gold thick film conductor on alumina and dielectric substrates[J].Hybrid Circuit Technology,1991(04):26. |
| [4] | Mei S;Yang J;Ferreira J M F .The densification and morphology of cordierite-based glass-ceramics[J].Materials Letters,2001,47:205. |
| [5] | Huang CL.;Lion CT.;Wu CC.;Weng MH. .Low temperature sintering and microwave dielectric properties of Ba2Ti9O20 ceramics using glass additions[J].Materials Research Bulletin: An International Journal Reporting Research on Crystal Growth and Materials Preparation and Characterization,2000(14/15):2445-2456. |
| [6] | Kim D W;Lee D G;Hong K S .Low-temperature firing and microwave dielectric properties of BaTiO9 with Zn-B-O glass system[J].Materials Research Bulletin,2001,36:585. |
| [7] | Chen CS.;Chou CC.;Shih WJ.;Liu KS.;Lin IN. .Microwave dielectric properties of glass-ceramic composites for low temperature co-firable ceramics[J].Materials Chemistry and Physics,2003(2/3):129-134. |
| [8] | Wu J M;Huang H L .Microwave properties of zinc,barium and lead borosilicate glasses[J].Journal of Non-Crystalline Solids,1999,260(01):116. |
| [9] | Nishikawa H.Development of zero X-Y shrinkage sintered ceramic subsbrate[A].,1993:238. |
| [10] | Takada T;Nakao S;Kojima M et al.Develop,analysis,and application of a glass-alumina-based self-constrained sintering low-temperature cofired ceramic[J].International Journal of Applied Ceramic Technology,2007,4(05):398. |
| [11] | Nakao S;Kojima M;Tanaka K .Constrained sintering of the sandwich substrate with inner-constraining fine particles layer (in Japanese)[J].Society of Powder Technology Japan,2004,41:350. |
| [12] | 崔学民,周济,王悦辉,缪春林,沈建红.异质材料共烧匹配性调制在LTCC领域的研究进展[J].电子元件与材料,2005(10):50-55. |
| [13] | 田民波 .一种制备零收缩率低温共烧陶瓷多层基板的工艺[P].CN 02129484,2004-02-25. |
| [14] | 戎瑞芬,汪荣昌,顾志光.银基多层氮化铝陶瓷基板低温共烧的工艺研究[J].半导体技术,2004(03):41-43,75. |
| [15] | Jean J H;Chang C R .Effect of silver-paste formulation on ceramic development during the cofiring of a silver-based,low-temperature-cofired ceramicPackage[J].Journal of the American Ceramic Society,1998,81(11):205. |
| [16] | Jean J H;Chang C R .Interfacial reaction kinetic between silver and ceramic-filled glass substrate[J].Journal of the American Ceramic Society,2004,87(07):1287. |
| [17] | Wang YG.;Zhang GN.;Ma JS. .Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,2002(1):48-53. |
| [18] | 徐忠华,马莒生,耿志挺,韩振宇,唐祥云.低温共烧陶瓷发展进程及研究热点[J].材料导报,2000(04):30-33. |
| [19] | 西北轻工业学院.玻璃工艺学[M].北京:中国轻工业出版社,1987 |
| [20] | 《电子元件材料手册》编写组.电子元件材料手册[M].北京:电子工业出版社,1989 |
| [21] | 王申,李淑华,谭惠民.陶瓷-金属的连接技术[J].飞航导弹,2002(06):55-58. |
| [22] | 马英仁.封接玻璃（六）[J].玻璃与搪瓷,1993(03):52. |
| [23] | 蔡春平.低熔点微晶封接玻璃的研究[J].应用光学,1995(05):33-39. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%