Sn-Bi系无铅焊料熔体结构转变及其对凝固组织及润湿性的影响

金属功能材料, 2010, 17(6): 36-39.

Sn-Bi系无铅焊料熔体结构转变及其对凝固组织及润湿性的影响

李小蕴 ^1, , 吴炜 ^2, , 陈红圣 ^3, , 祖方遒 ^4,

1.合肥工业大学材料科学与工程学院,安徽,合肥,230009;合肥工业大学机械与汽车工程学院,安徽,合肥,230009

2.合肥工业大学,工业培训中心,安徽,合肥,230009

3.合肥工业大学材料科学与工程学院,安徽,合肥,230009

4.合肥工业大学材料科学与工程学院,安徽,合肥,230009

关键词：无铅焊料 , Sn-Bi合金 , 熔体结构转变 , 电阻率

Structure Transition of Lead-free Sn-Bi Solders and Its Effects on Solidification and Wettability

本文通过电阻法研究了Sn-57%Bi无铅焊料在液相线以上一定温度范围内发生熔体结构转变的可能性及规律性,并以此为切入点研究了熔体结构转变前后Sn-57%Bi焊料的凝固组织和润湿性能的变化规律.结果表明:Sn-57%Bi无铅焊料在液相线以上785～900℃范围内发生了熔体结构转变,而且熔体结构转变细化了凝固组织,改变了微观形貌;经历熔体结构转变而凝固的合金焊料较未发生转变的合金铺展面积增大,润湿角减小.

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Sn-Bi系无铅焊料熔体结构转变及其对凝固组织及润湿性的影响

Structure Transition of Lead-free Sn-Bi Solders and Its Effects on Solidification and Wettability

参考文献