欢迎登录材料期刊网

材料期刊网

高级检索

The Mg65Cu25Y10 melts were quenched at a temperature of 973 K under various pressures in the range of 2~5 GPa and ambient pressure. The microstructure of the solidified specimens has been investigated by X-ray diffraction,transmission electron microscope and electron probe microanalysis. Experimental results show that the pressure has a great influence on the solidification microstructure of the Mg65Cu25Y10. At ambient pressure, the solidification products are Mg2(Cu,Y) and a very small amount of Y2O3 inclusion. As the pressure is above 2 GPa, a new Cu2(Y,Mg) phase appears, while Y2O3 is not observed at the pressure of 3, 4 and 5 GPa. When the pressure increases from 2 GPa to 5 GPa, the grain sizes of Mg2(Cu,Y) and Cu2(Y,Mg) decrease from 125, 96 nm to 80,7 nm, respectively. The mechanisms for the effects of the pressure on the phase evolution and microstructure during solidification process of Mg65Cu25Y10 alloy have been discussed.

参考文献

[1] A Inoue;T Masumoto .[J].Materials Science and Engineering,1993,173:1.
[2] S J Savage;F H Froes;B H Kear;B.C.Giessen.Rapidly Solidified Metastable Materials[M].New York,1984:329.
[3] R ormann .[J].Materials Science and Engineering,1997,226-228:268.
[4] A J Drehman;A L Greer .[J].Acta Materialia,1984,32:322.
[5] A J Drehman;A L Greer;D Turnbull .[J].Applied Physics Letters,1982,41:716.
[6] D.R.Uhlmamm;J.F.Hays;D.Turnbull .[J].Physics and Chemistry of Glasses,1966,7:159.
[7] L Y Gao;Y Xue;F chen;Q.Xiong, R.L.Meng, D.R.Amirez and H.K.Mao .[J].PHYSICA C,1994,235:1493.
[8] L J Parker;T Atou;J V Badding .[J].Science,1996,273:95.
[9] D He M He;C S Kiminami;F X Zhang;Y.F.Xu, W.K.Wang and K.H.Kuo .[J].Materials Research,2000,16:910.
[10] Z.Y.Shen;D.J.Shen;Y.Zhang .[J].Acta Metallurgica Et Materialia,1992,40:2185.
[11] L L Sun;Q Wu;L M Wang;Y.S.Yao,D.Y.Dai,J.Zhang and W.K.Wang .[J].Materials Transactions,2001,42:579.
[12] Yao;F S Li;X M Lin;B Z Ding W H Su and Z Q Hu .[J].Non-Crystalline Solid,1997,217:317.
[13] Varga;A Lovas;F Ye;X J Gu and K Lu .[J].Materials Science and Engineering,2000,286:193.
[14] W H Wang;D W He;D Q Zhao;Y S Yao .[J].Applied Physics Letters,1999,75:2770.
[15] S Murty;K Honu .[J].Materials Transactions,2000,41:1538.
[16] J Z Jiang;J S Olsen;L Gerward;S.Abdali L.Schultz J.Truckenbrodt and P.X.Shi .[J].Journal of Applied Physiology,2000,87:2664.
[17] W K Wang;H Iwasaki;C Suryanarayana;T Masumoto .[J].Journal of Materials Science,1983,18:3765.
[18] D Turnull .[J].Prog:Sol:State Phys,1956,3:225.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%