高纯金(wAu>99.999%)在电子、半导体和通讯行业中的靶材、引线和集成电路等方面应用日益广泛.介绍了高纯金制备技术包括化学还原法、萃取法和电解法的基本原理和工艺流程及各自存在的优缺点,并阐述了高纯金制备技术的研究现状,对其发展前景进行了展望.
High-purity gold (wAu>99.999%) is widely applied to target material, lead wire and integrated circuit in electronic, semiconductor and communication industry. The basic principles and processes for preparing high-purity gold by using chemical reduction method, solvent extraction and electrolysis were described in this article, and advantages and disadvantages of different methods were compared to each other. The future developments were also given.
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