介绍了无卤阻燃剂标准,含卤阻燃剂的使用现状、各国禁卤法规以及各大公司无卤印制电路板(PCB)转换进程;详细分析了PCB中阻燃刑种类及其作用机理,并总结出阻燃剂主要通过切断燃烧三要素来源达到阻燃目的;最后综述了无卤PCB开发现状及其失效和可靠性分析现状.由于新型电子产品对PCB的性能要求愈来愈高,同时又要满足无卤无铅的环保要求,单一阻燃荆很难达到要求,因此多种阻燃剂的协同作用是目前研究的热点方向之一.目前对于使用无卤基板材料后电子产品失效及可靠性方面的参考资料较少,也是需要进一步研究的方向之一.
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