用复合电沉积的方法制备出新型的Cu-30Ni-20Cr纳米复合镀层，该镀层的组织结构与Cu-Ni-Cr三元合金不同，是由Cu-Ni基固溶体（晶粒尺寸为~60nm）和纳米Cr颗粒（平均尺寸~28nm）组成。与相同的工艺条件下制备的Cu-40Ni合金镀层相比，Cu-30Ni-20Cr纳米复合镀层在800℃空气中氧化速率显著降低，这是由于它能迅速形成一层连续、致密的Cr2O3膜。本文对Cr颗粒在Cu-30Ni-20Cr纳米复合镀层高温氧化过程中所起的作用进行了讨论。
A novel electrodeposited Cu-rich Cu-30Ni-20Cr nanocomposite was fabricated on pure copper substrate by co-electrodeposition of Cu-Ni alloy base (mean grain size: 60 nm) with Cr nanoparticles (meansize: 28 nm) from a sodium citrate bath. Compared with electroplated Cu-40Ni alloy film prepared using the same bath, the Cu-30Ni-20Cr nanocomposite exhibited an extremely low oxidation rate in air at 800oC, due to the fast formation of a continuous Cr2O3 scale. The effect of the Cr nanoparticles on the oxidation behavior of the Cu-Ni-Cr nanocomposite films is discussed in detail.
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| [1] | |
| [2] | |
| [3] | |
| [4] | |
| [5] | |
| [6] |
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