本文研究了室温下氧化铜用金属镁作还原剂的机械还原.电镜和X射线衍射结果都表明,室温下球磨32h后,CuO基本被还原.还原后晶粒细化到平均尺寸小于20nm,由此提出了机械力驱动下,纳米级界面激活的机械还原机制。
The mechanical reduction of CuO by pure metallic Mg has been investigated during pulverizing in ball mill at room temperature. The reduction was towards its completion of an average particle size down to 20nm after 32h. The mechanism of mechanical reduction of oxide seems to be proposed as the surface activation of nm sized particles driven by mechanical force.
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