在675～750℃、氮气气氛下,使用石墨模具压铸的方法将金属纯Al敷接在AlN电子陶瓷基板上,随后利用力学拉伸试验机测试了Al和AlN的结合强度,其界面抗拉强度>15.94MPa,然后使用金相显微镜、SEM等微观分析仪器研究其界面的微观结构,发现在Al/AlN界面没有任何新物质生成,金属铝晶粒直接在AlN陶瓷表面结晶长大.
In this work, by die-casting-bonding process, in 948-1098K and N2 atmosphere, Al/AlN substrate was produced
successfully. The bonding strength of Al and AlN substrate tested by mechanic testing equipment was more than 15.56MPa; The micorstructure
of Al/AlN interface was investigated by SEM and microscope. The results show that there is nothing produced in the interface of Al/AlN,
the crystal of aluminium grows on the surface of AlN directly, the bonding temperatures have no influence on Al/AlN interface strength.
参考文献
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