综述了介孔材料的合成方法、分类、形成机理、形貌控制和应用.目前各种形状如球形、棒状、片状、螺旋形和绳形等形状的介孔材料已经采用溶胶-凝胶、自组装、微乳、反胶束和超声等方法合成出来.按化学组成介孔材料分为硅基和非硅介孔材料,硅基介孔材料已被很好地研究,相反,非硅介孔材料虽然有着广泛的应用前景但研究不多.介孔材料的几种形成机理已经被提出, 主要包括液晶模板和协同组装机理.作者也采用化学超声和反胶束方法制备出新奇的介孔二氧化钛粉末和薄膜材料, 其光催化活性明显高于普通二氧化钛粉末和薄膜材料.
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