高频放电氮气等离子体表面处理纳米碳化硅粉体,进而在碳化硅表面上引发甲基丙烯酸甲酯单体接枝聚合,在纳米碳化硅表面形成一层保护膜.红外(FTIR),X射线光电子能谱(XPS)以及热失重分析(TGA)测试表明该聚合膜是通过化学键连接在碳化硅表面的,X射线衍射光谱(XRD)表明经等离子体处理改性的碳化硅粉体只是其表面性质发生了改变,其晶体结构并没有发生任何变化.
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