Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

材料科学技术（英文）, 2011, 27(8): 741-745.

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

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1.Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang 110004, China

2.Shenyang Aerospace University, Shenyang 110136, China

3.Shenyang Aerospace University, Shenyang 110136, China

4.Shenyang Aerospace University, Shenyang 110136, China

5.Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang 110004, China

6.Shenyang Aerospace University, Shenyang 110136, China

基金项目: Program for New Century Excellent Talents in University(NCET-06- 0288) Foundation of National Excellent Doctoral Dissertation of China(200745) This work is supported by the National Natural Science Foundation of China(50871026) the Fundamental Research Funds for the Central Universities(N090109001) the 111 Project(B07015)

关键词：金属间化合物 , 生长动力学 , 无铅焊锡 , 铜互连 , 微电子 , IMC , 生长过程 , 焊料合金

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

Keywords： Solder , Interfacial reaction , Intermetallics , Kinetics ,

The intermetallic compound （IMC） growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210℃ for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service.

参考文献

[1]	C. Z. Liu;W. Zhang .Bismuth redistribution induced by intermetallic compound growth in SnBi/Cu microelectronic interconnect[J].Journal of Materials Science,2009(1):149-153.

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Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

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