陶瓷表面金属化处理的传统镀银工艺存在工艺复杂、设备投资大、成本高、耐焊及耐磨性不足等缺点,使用化学镀铜技术可以很好地解决上述问题.用电化学等方法,研究了添加剂亚铁氰化钾、2,2'-联吡啶和L-精氨酸对陶瓷化学镀铜镀液的沉积速度与稳定性、镀层的耐腐蚀性、导电性及结合力的影响.结果表明:用4%AgNO_3作为活化荆,代替价格昂贵的PdCl_2,效果较好.陶瓷镀铜最佳配方和工艺为:15 g/L硫酸铜,10 mL/ L甲醛,40 g/L酒石酸钾钠,pH值12.6,室温,施镀时间1 h,无搅拌.添加剂最佳使用量分别为:5mg/L亚铁氰化钾;5 mg/L 2,2'-联吡啶;10 mg/L L-精氨酸以及二元复合添加剂5 mg/L 2,2'-联吡啶+10mg/L L-精氨酸.所得陶瓷镀铜层呈现光亮的淡粉红色.
The influences of additives [K_4Fe(CN)_6, 2,2' -dipyridyl and L-arginine] on the depositing rate and stability of electroless copper bath and the corrosion resistance, conduction and adhesion of copper plating were investigated using electrochemical methods etc. Results show that 4% AgNO_3 can be well used as the activation agent to replace expensive PdCl_2. The optimum formula for dectrolcss Cu plating was determined as 15 g/L CuSO_4, 10 mL/L HCHO, 40 g/L sodium potassium tartrate; and the optimal plating parameters were determined as pH value of 12.6, room temperature, plating time of 1h. The dosages of additives were determined as 5 mg/LK_4Fe(CN)_6, 5 mg/L 2,2'-dipyridyl, 10 mg/L L-arginine, and 5 mg/L2,2' -dipyridyl + 10 mg/L L-arginine. The resulting eleetroleas Cu coating looks bright and light pink.
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