随着微电子技术的高速发展,金刚石/金属复合材料作为新一代的电子封装材料受到了广泛的重视,它与传统的电子封装材料相比,具有更优异的性能,是未来封装、热沉材料最有潜力的发展方向之一.对金刚石/金属复合材料的性能、制备工艺及应用发展进行了综述,并提出了未来的研究开发方向.
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