研究了高温对SnAgCu+xCo (x=0,0.1,0.2,0.45,1.0,x为质量分数%,下同)复合钎料接头显微组织和力学性能的影响.用差热分析法(DSC)分析了Co对钎焊接头过冷度和凝固相的影响.与Sn-3.0Ag-0.5Cu钎料相比,焊后SnAgCu+xCo (x=0.1, 0.2)复合钎料界面金属间化合物层厚度减小,接头剪切强度提高.经150 ℃保温500 h后,SnAgCu+xCo复合钎料接头剪切强度均高于Sn-3.0Ag-0.5Cu钎料接头,说明Co的添加可以改善SnAgCu钎料的服役可靠性.经DSC分析,Co的添加会提高SnAgCu钎料合金的凝固点,从而降低其过冷度.综上,Sn-3.0Ag-0.5Cu-0.2Co复合钎料接头的力学性能和服役条件下的可靠性最佳.
参考文献
| [1] | F. GUO;S. CHOI;J.P. LUCAS .Effects of Reflow on Wettability, Microstructure and Mechanical Properties in Lead-Free Solders[J].Journal of Electronic Materials,2000(10):1241-1248. |
| [2] | 郭福.Lead-Free Soldering Technology and Appli-cation(无铅钎焊技术与应用)[M].北京:科学出版社,2006 |
| [3] | Turbini L J.[J].Journal of Material Science:Material Electron,2006(01):147. |
| [4] | Shen J;Lai S;Liu Y;Gao H;Wei J .The effects of third alloying elements on the bulk Ag3Sn formation in slowly cooled Sn-3.5Ag lead-free solder[J].Journal of Materials Science. Materials in Electronics,2008(3):275-280. |
| [5] | J.G.Lee;K.N.Subramanian;K.C.Chen .Formation an Growth of Intermetallics around Metallic particles in Eutectic Sn-Ag Solder[J].Journal of Electronic Materials,2003(11):1240-1248. |
| [6] | Xu L H;Johan H L;Pang K H et al.[J].IEEE Transactions on Components Packaging and Manufacturing Technology,2005,28(03):408. |
| [7] | Anderson I E .[J].Journal of Material Science:Material Electron,2007,76:55. |
| [8] | Swenson D .[J].Journal of Material Science:Material Electron,2007,18:39. |
| [9] | Anderson I E;Walleser J;Harringa J L.[J].JOM-Journal of the Minerals Metals and Materials Society,2007(01):38. |
| [10] | Anderson I E;Foley J C;Cook B A et al.[J].Journal of Electronic Materials,2001,30(09):1050. |
| [11] | Lee J S;Chu K M;Patzelt R et al.[J].Microelectronic Engineering,2008,85:1577. |
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