硅酸盐通报 , 2010, 29(4): 798-803.
橡胶集料混凝土配合比设计及强度试验研究
周梅 1, , 张晓帆 2, , 薛忠泉 3,有序孔材料指孔尺寸均一,在空间有序排列的系列材料,是材料科学研究的一个崭新方向,具有重要的理论研究和实际应用意义.总结了有序孔材料的结构设计、合成制备和应用等方面的研究现状.","authors":[{"authorName":"齐凯","id":"3de5710c-4ffc-4aa4-ba07-e2d545d1db4d","originalAuthorName":"齐凯"},{"authorName":"牛忠伟","id":"253dac13-1cce-4b20-833c-a20e2e723a83","originalAuthorName":"牛忠伟"},{"authorName":"容建华","id":"600dde35-8cad-4cf9-88a7-44872b4db94b","originalAuthorName":"容建华"},{"authorName":"杨振忠","id":"a9613dc0-4dda-4fd7-8691-b73529e674ff","originalAuthorName":"杨振忠"}],"doi":"","fpage":"47","id":"c1e9d5d9-4ea2-4b5f-896b-e04279a8d711","issue":"6","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"3515536d-80a9-42b9-8e56-8c50f2495555","keyword":"有序孔材料","originalKeyword":"有序孔材料"},{"id":"c80f44a9-1255-43e3-a13c-09316424c3cf","keyword":"模板技术合成","originalKeyword":"模板技术合成"},{"id":"2d95e1ec-dc17-4525-883d-96019c9ea2f9","keyword":"实际应用","originalKeyword":"实际应用"}],"language":"zh","publisherId":"cldb200106019","title":"有序孔材料的发展现状","volume":"15","year":"2001"},{"abstractinfo":"综述了刚柔嵌段共聚物自组装机理,以及近年来利用刚柔嵌段共聚物自组装制备有序孔材料的发展状况,指出刚柔嵌段共聚物制备有序孔材料的影响因素,认为刚柔嵌段共聚物自组装有着广阔的应用前景.","authors":[{"authorName":"张学骜","id":"94fd1fc0-41d5-43d8-be77-0e390a86c1db","originalAuthorName":"张学骜"},{"authorName":"龙永福","id":"81debf79-3799-4870-85f2-096cf1246d7d","originalAuthorName":"龙永福"},{"authorName":"谢凯","id":"95a6b45e-d259-4503-a0b5-4fd5c9a875ac","originalAuthorName":"谢凯"},{"authorName":"安立华","id":"55a9efdb-0eec-4d65-b38d-d4f4d3a9cfcf","originalAuthorName":"安立华"}],"doi":"","fpage":"71","id":"d62ddf60-f043-4913-b259-12e4442bd8c0","issue":"9","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"ab79c192-2bce-405d-874c-f53e538a456e","keyword":"刚柔嵌段共聚物","originalKeyword":"刚柔嵌段共聚物"},{"id":"fc692ad8-63e5-4c4a-8bd2-d7d0ee33904e","keyword":"自组装","originalKeyword":"自组装"},{"id":"ccb3216b-f98e-4707-b6b3-c09236007c8b","keyword":"有序孔材料","originalKeyword":"有序孔材料"}],"language":"zh","publisherId":"cldb200309022","title":"刚柔嵌段共聚物自组装制备有序孔材料研究进展","volume":"17","year":"2003"},{"abstractinfo":"有序介孔材料作为一种新型的纳米结构材料,近年来已成为跨学科的国际研究热点之一.综述了有序介孔材料的合成及其机理,指出有序介孔材料在分离、催化、纳米技术等领域的潜在应用价值.","authors":[{"authorName":"谢永贤","id":"f0649d69-5027-4479-8215-48cd5d8d09f9","originalAuthorName":"谢永贤"},{"authorName":"陈文","id":"65cbc0f3-4aa3-44a2-9132-dea0993fcac6","originalAuthorName":"陈文"},{"authorName":"徐庆","id":"dd7fea64-80ef-464a-b846-aa10e476dd4b","originalAuthorName":"徐庆"}],"doi":"","fpage":"51","id":"6391af15-ba07-4bab-9ce2-aa8d63550b3e","issue":"1","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"78fc7531-b8b4-45b5-b5ac-afe4c1e73ac7","keyword":"有序介孔","originalKeyword":"有序介孔"},{"id":"2a4a6e5e-2a4b-4c67-baa0-ec659ce84314","keyword":"合成","originalKeyword":"合成"},{"id":"6f63969a-b808-4e7d-8875-8904cc6b8cb5","keyword":"机理","originalKeyword":"机理"},{"id":"e4b3196e-93dc-4b47-9305-17fb84300bf2","keyword":"纳米尺度","originalKeyword":"纳米尺度"}],"language":"zh","publisherId":"cldb200201016","title":"有序介孔材料的合成及机理","volume":"16","year":"2002"},{"abstractinfo":"过渡金属体系有序介孔材料在催化、光、电、磁等领域有着硅基介孔材料无法比拟的优越特性.详细地介绍了过渡金属体系有序介孔材料的合成和机理,简要地介绍了其应用.","authors":[{"authorName":"陈龙","id":"b824b866-2c15-4776-bfca-afb6ec896f84","originalAuthorName":"陈龙"},{"authorName":"陈文","id":"136c2653-b334-40d0-bbc4-ab55ad6af879","originalAuthorName":"陈文"},{"authorName":"马志勇","id":"a99a32da-5040-4fc3-afed-28f6b0fa25d5","originalAuthorName":"马志勇"},{"authorName":"李澧","id":"3d83cf5c-d455-42a0-932c-b2dc418733aa","originalAuthorName":"李澧"}],"doi":"","fpage":"10","id":"a4a44334-1339-4e2b-ba7c-465e3b94c494","issue":"1","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"e52a00ba-bea9-4b4f-8466-c937b44ff6c4","keyword":"过渡金属","originalKeyword":"过渡金属"},{"id":"3fc0e69e-0df0-4cb5-b6da-9deac4573414","keyword":"有序介孔","originalKeyword":"有序介孔"},{"id":"d8c60822-b4bf-4f2d-adad-56eaa43ad367","keyword":"研究进展","originalKeyword":"研究进展"}],"language":"zh","publisherId":"cldb200401003","title":"过渡金属体系有序介孔材料研究进展","volume":"18","year":"2004"},{"abstractinfo":"利用微波进行化学合成是近年发展起来的一种简单、快捷、高效的合成方法.综述了微波在有序介孔材料合成、模板剂脱除和在介孔材料负载活性组分中的应用,介绍了一些典型的有序介孔材料的微波合成新进展,指出了该方法在有序介孔材料合成中的优势及发展前景.","authors":[{"authorName":"姜燕","id":"45021fac-5a2c-40eb-882d-55b493d50fbf","originalAuthorName":"姜燕"},{"authorName":"郭万林","id":"ba0bc4c2-b750-44ae-b5da-1f0f6d945546","originalAuthorName":"郭万林"},{"authorName":"台国安","id":"8a2f0ece-2390-4ad0-a24e-fc6b75f0c424","originalAuthorName":"台国安"}],"doi":"","fpage":"24","id":"152b7fee-43fc-4394-9c7f-464bf0c075c8","issue":"4","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"05d8f6da-c5ef-4aa3-8ba5-e18b1f74498b","keyword":"介孔材料","originalKeyword":"介孔材料"},{"id":"c9ad01c4-adaf-4982-b279-d9b1be3f04f0","keyword":"微波加热","originalKeyword":"微波加热"},{"id":"7d1bbf57-399d-4a77-91b9-d1d5cf7900ae","keyword":"合成","originalKeyword":"合成"}],"language":"zh","publisherId":"cldb200504007","title":"微波加热在有序介孔材料研究中的进展","volume":"19","year":"2005"},{"abstractinfo":"根据近10年来有序介孔材料用于药物传递系统的研究报道,综述了几种新型介孔材料的合成方法,讨论分析了药物传递系统中孔径、孔道长度、形貌和功能基团修饰等影响因素,着重阐述和评价了影响有序介孔材料结构特征的合成工艺条件,以及这些有序介孔材料潜在的药学应用价值和急需解决的问题,旨在为新型有序介孔材料在药物传递系统中的应用提供参考.","authors":[{"authorName":"钟国英","id":"c14c6e16-0093-43e2-8653-29a0aa4661a5","originalAuthorName":"钟国英"},{"authorName":"王秀芳","id":"b3d0ed1a-f441-49c4-a6e1-5117bb06235d","originalAuthorName":"王秀芳"},{"authorName":"林汉森","id":"0eb9885b-870f-48b7-a210-fc8e4fc160a8","originalAuthorName":"林汉森"}],"doi":"","fpage":"71","id":"854a7d3b-4d3a-4185-966a-ecbb2a2226a7","issue":"19","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"52bae830-c42e-4b19-827a-99df52479b13","keyword":"有序介孔材料","originalKeyword":"有序介孔材料"},{"id":"549d920f-ece6-41e4-8ab8-0aee9743d49b","keyword":"药物传输","originalKeyword":"药物传输"},{"id":"6e908f58-c0b2-43d3-a3be-f831cd34d4b6","keyword":"药物载体","originalKeyword":"药物载体"}],"language":"zh","publisherId":"cldb201019015","title":"新型有序介孔材料在药物传递系统中的应用","volume":"24","year":"2010"},{"abstractinfo":"采用微湿含浸法制备了一系列具有不同比表面积和孔径分布的超级电容器有序中孔炭材料.采用液氮吸附脱附等温线、小角XRD以及TEM表征了有序中孔炭的孔结构,在1 M Et_4NBF_4 IPC电解液中测试了其电化学性能.结果表明,所制得的有序中孔炭的BET比表面积随糠醇加入量的增加先增加后减小,糠醇加入量少制得具有CMK-5结构的有序中孔炭,加入量多制得的CMK-3结构.电化学性能测试结果表明,在1mA·cm~(-2)的充放电电流密度下各有序中孔炭材料比电容的大小顺序与其BET比表面积的大小顺序基本一致,具有CMK-3结构的有序中孔炭的倍率性能最好,并且也好于无序中孔炭的.","authors":[{"authorName":"赵家昌","id":"a02c88ef-a47b-4871-bfb5-1782d9c7d6a1","originalAuthorName":"赵家昌"},{"authorName":"张熙贵","id":"bbdaa02e-cb2c-4616-b287-e25a19854a0a","originalAuthorName":"张熙贵"},{"authorName":"郑静","id":"d9ddf17c-efba-4b27-9c04-161811fb42cb","originalAuthorName":"郑静"},{"authorName":"孙锦晶","id":"21b1f280-2ba5-4452-a742-87c4126e8b59","originalAuthorName":"孙锦晶"},{"authorName":"徐菁利","id":"e734bbaa-55cc-4bd8-816c-a72954bbaf84","originalAuthorName":"徐菁利"}],"doi":"10.3969/j.issn.1007-4252.2009.05.011","fpage":"477","id":"90fca1a1-1eb8-49a5-b1fa-5fd14269904a","issue":"5","journal":{"abbrevTitle":"GNCLYQJXB","coverImgSrc":"journal/img/cover/GNCLYQJXB.jpg","id":"34","issnPpub":"1007-4252","publisherId":"GNCLYQJXB","title":"功能材料与器件学报 "},"keywords":[{"id":"ff12200a-8dca-44eb-9a2b-86d0e831d5dc","keyword":"超级电容器","originalKeyword":"超级电容器"},{"id":"1f78c385-0a2f-4a4c-ba26-f91ace046c6e","keyword":"有序中孔炭","originalKeyword":"有序中孔炭"},{"id":"f63a3b21-35b3-4861-9e7d-e75948fb86f9","keyword":"糠醇","originalKeyword":"糠醇"},{"id":"66c51a22-4046-4f77-b9d0-4d430ab562bf","keyword":"电化学性能","originalKeyword":"电化学性能"}],"language":"zh","publisherId":"gnclyqjxb200905011","title":"高性能超级电容器有序中孔炭材料的研制","volume":"15","year":"2009"},{"abstractinfo":"由于介孔材料在化学工业、信息通讯、生物技术、环境能源等领域具有种种潜在的用途,近年来倍受关注.总结了多种有序介孔材料合成与制备的研究、影响因素及常用的表征方法.","authors":[{"authorName":"刘建红","id":"90a923d5-96b4-4a2a-9b22-0b8afda968d9","originalAuthorName":"刘建红"},{"authorName":"杨儒","id":"33fa8724-8d16-4414-81d8-44f1fb714b29","originalAuthorName":"杨儒"},{"authorName":"刘家祥","id":"eb9fb782-cdbc-4817-ab51-4e2fc0a99a9a","originalAuthorName":"刘家祥"},{"authorName":"李敏","id":"5fd8a0da-8cd5-4972-8b0e-044399566ddc","originalAuthorName":"李敏"},{"authorName":"严彩霞","id":"aa9999be-eee8-4ca4-b6aa-216cc4d79b51","originalAuthorName":"严彩霞"}],"doi":"","fpage":"52","id":"3e8fa214-cd31-4117-a69e-d6d0073769a2","issue":"9","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"94f3b24c-5aff-42ce-97f3-4cd1693c44fe","keyword":"有序介孔材料","originalKeyword":"有序介孔材料"},{"id":"cfef2c2c-ca88-46f6-ac82-402e76572cb1","keyword":"合成","originalKeyword":"合成"},{"id":"8b3167cf-01b4-44e5-ac64-67625c9f8833","keyword":"表征","originalKeyword":"表征"}],"language":"zh","publisherId":"cldb200209018","title":"有序介孔材料的合成及表征方法","volume":"16","year":"2002"},{"abstractinfo":"有序碳基介孔材料具有比表面积大、导电和导热性高、化学稳定性好等特点,因而受到人们的密切关注.基于最新研究进展,总结了有序碳基介孔材料的硬模板法、软模板法合成路线及功能化方式,评述了各种方法的特点及局限性,并介绍了该类材料在吸附分离、催化、生物传感器以及能量存储等方面的应用研究进展.","authors":[{"authorName":"李俊芳","id":"3e593b05-046d-458c-9e3c-f4afbc4301f6","originalAuthorName":"李俊芳"},{"authorName":"杨海峰","id":"c89eacce-23cf-4b87-8c67-a5456b6ba070","originalAuthorName":"杨海峰"},{"authorName":"卢晓静","id":"3d8d7484-fe1e-408c-af52-79619cc2e69b","originalAuthorName":"卢晓静"},{"authorName":"席广成","id":"a6ad283b-5ab1-4e3a-96ef-12cf1f564046","originalAuthorName":"席广成"},{"authorName":"张轩","id":"fa2cbc8b-f649-4571-945e-5e647a0c0db6","originalAuthorName":"张轩"},{"authorName":"胡超","id":"4e6779f8-d558-4549-a71a-7d348a0328a6","originalAuthorName":"胡超"},{"authorName":"闫妍","id":"e08f6459-0396-491e-b8f4-29e41d32586a","originalAuthorName":"闫妍"}],"doi":"","fpage":"259","id":"3e01223b-b132-4ac5-8172-cfa336173e77","issue":"z2","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"626ca8d8-b539-457b-a3c4-785b8909d12e","keyword":"有序介孔碳","originalKeyword":"有序介孔碳"},{"id":"0c9a6ba5-c7c0-4924-b219-c249c73d794f","keyword":"硬模板","originalKeyword":"硬模板"},{"id":"8f198257-68f8-4ed7-930a-a6d8b6ef6bce","keyword":"软模板","originalKeyword":"软模板"}],"language":"zh","publisherId":"cldb2013z2071","title":"有序碳基介孔材料的合成与应用研究进展","volume":"27","year":"2013"},{"abstractinfo":"本文采用聚苯乙烯胶体晶体模板,使用Sol-gel法制备的Ti02溶胶对胶晶模板进行填充,经高温热处理后获得TiO2三维有序大孔结构.采用扫描电子显微术(SEM),透射电子显微术(TEM),BET法,能量色散谱(EDS)以及红外光谱术(IR)对三维有序大孔结构进行了表征.研究表明改变热处理温度和聚苯乙烯球尺寸,可对三维有序大孔结构进行调控；同时本文重点研究了孔壁显微结构和化学组成等表面特性.","authors":[{"authorName":"徐骁龙","id":"a2390db7-981e-4e8a-bec6-e8d4f702740b","originalAuthorName":"徐骁龙"},{"authorName":"张辉","id":"4718584b-2859-4649-b669-6efd20ca7724","originalAuthorName":"张辉"},{"authorName":"刘盛楠","id":"2549937a-2780-4ef6-a7c1-042e8a3e07a1","originalAuthorName":"刘盛楠"},{"authorName":"李钒","id":"dbcee983-ffb3-42b0-9607-12c6237ce92c","originalAuthorName":"李钒"},{"authorName":"万金秀","id":"93f17bb1-739c-42d1-9697-2a0befd54a8e","originalAuthorName":"万金秀"},{"authorName":"杨辉煌","id":"c8b654f8-0448-450e-ac66-f8da03f0e6a0","originalAuthorName":"杨辉煌"}],"doi":"","fpage":"461","id":"6763c169-0fe3-4ced-b634-834785a6820c","issue":"3","journal":{"abbrevTitle":"RGJTXB","coverImgSrc":"journal/img/cover/RGJTXB.jpg","id":"57","issnPpub":"1000-985X","publisherId":"RGJTXB","title":"人工晶体学报"},"keywords":[{"id":"f29a5a17-a45d-42f0-9231-d478c02927fa","keyword":"三维有序大孔","originalKeyword":"三维有序大孔"},{"id":"9c4f4880-a6d8-4ae1-91eb-7ef12817731b","keyword":"TiO2","originalKeyword":"TiO2"},{"id":"675654a7-0919-46ee-92a0-ac342e0a6419","keyword":"表面特性","originalKeyword":"表面特性"}],"language":"zh","publisherId":"rgjtxb98201303017","title":"TiO2三维有序大孔材料的表面特性研究","volume":"42","year":"2013"}],"totalpage":13742,"totalrecord":137414}