研究了C194铜合金引线框架表面氧化状态对封装树脂结合强度的影响.铜合金引线框架与树脂的结合强度随氧化膜厚度的增加而先增加后减小,并在厚度为100 nm时达到最大值15.3MPa,比氧化前提高了2.6 MPa.其原因在于氧化膜能够提高与封装树脂之间的润湿性,而氧化膜较厚时,断裂更易发生在疏松的氧化膜中,从而降低了结合强度.防铜变色剂处理可以通过有效减缓氧化膜生长来控制其结合强度.
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