采用粒径为400 nm的纳米级氮化铝对聚酰亚胺进行填充，制备了纳米氮化铝增强的聚酰亚胺基覆铜板，研究了纳米氮化铝含量对聚酰亚胺膜及聚酰亚胺基覆铜板各项性能的影响。结果表明：随着纳米氮化铝含量的增加，聚酰亚胺膜的热导率、热稳定性相应增加，而断裂延伸率及其与铜箔之间的剥离强度则大幅下降。当纳米氮化铝的含量为40%时，聚酰亚胺膜基覆铜板的综合性能最佳。
A polyimide based copper clad laminate was prepared by filling 400nm size aluminum nitride to poly-imide, and the effects of nano aluminum nitride content on the various properties of the polyimide film and polyimide based copper clad laminate were studied. The results show that with the increase of nano aluminum nitride content, the thermal conductivity and thermal stability of the PI film increase, and the elongation at break of the PI film and the peel strength between PI film and copper foil decrease greatly. When the nano alu-minum nitride content is 40%, the polyimide based copper clad laminate has the best comprehensive properties.
参考文献
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