目前,对无氰镀银的电沉积机理及从分子配位机理角度的研究报道较少.采用循环伏安法(CV)测试,结合量子化学计算和镀银层表面形貌的SEM分析,研究了配位剂5,5-二甲基乙内酰脲(DMH)对银电沉积过程的影响.结果表明,Ag+与DMH配位后,还原电位负移;不同DMH浓度和pH值条件下,DMH与Ag+形成的配合物形式以及配合物稳定性均不同,随着DMH浓度增大及pH值升高,形成的配合物也更稳定;当pH值为10时,DMH与Ag+能够形成稳定的配合物[Ag(C5H7N2O2)]和[Ag(C5H7N2O2)2]-,在适宜的电位范围内能够制备出结构致密、表面平整、光亮的银镀层.
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