由于具有较低的电阻率和成本、较好的机械加工性能、设计上的灵活性,可室温沉积等优点,银基透明导电多层膜已广泛应用于低辐射膜、强电磁屏蔽、低功耗光电子器件特别是柔性电子器件等领域.但由于材料自身的性质与制备条件的差异性,实际制备的金属/电介质(或半导体)透明导电多层膜界面处往往存在表面等离子体共振、界面导电电子散射、膜层脱层开裂等问题,这些均与多层膜界面特性密切相关.本文针对这类问题,评述了近年来银基透明导电多层膜界面研究的进展,并对今后发展给予分析和展望.
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