用数值模拟的方法对矩形通道微流控芯片中由于焦耳热效应而产生的温度场分布进行了分析.通过求解耦合的动量以及能量方程,得到了PDMS/PDMS芯片中温度场的瞬态发展过程.对稳定状态下不同缓冲溶液浓度,底片材质以及厚度的芯片中的温度场分布也做了比较和分析.结果表明,相比于PDMS/PDMS芯片,相同条件下PDMS/玻璃芯片中的焦耳热效应会减小很多,而缓冲溶液浓度以及芯片厚度对缓冲溶液的出口平均温度也有显著影响.最后提出了减小焦耳热效应的方法.
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