多层陶瓷电容器(MLCCs)体现了电子元器件小型化、复合化、低成本、高可靠性的发展趋势.BME(BaseMetal Electrode)技术的发展促进了Ni内电极MLCCs的生产和应用.为了适应贱金属Ni内电极MLCCs还原气氛烧结需要,对介质瓷料提出了抗还原性要求,使其具有高的绝缘电阻率和长的工作寿命.综述了BaTiO3基介质瓷料的抗还原性措施,涉及电子缺陷浓度的降低以及氧空位缺陷迁移的抑制,并利用缺陷化学阐述了其A位施主和B住受主掺杂的改性机理.
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