为节约Cr资源,提高CuCr触头材料的耐电击穿性能并满足其大规模生产的需要,根据W、Co的选择相强化作用, 以纯Cu、Cr块为原料, 采用Ar气保护熔炼法制备CuCr25W1Col触头合金,并对其性能进行研究.实验结果表明,该合金晶粒尺寸细小,含气量低,耐电压强度已达到常规触头材料的水平.
参考文献
[1] | 陈玉秀 et al.[J].高压电器,1991,2:55. |
[2] | Slade P G .Advances in Materials Development for High Power Vacuum Interrupter Contacts[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1994,17(01):96-106. |
[3] | Muller R .Arc-Melted CuCr Alloys as Contact Materials for Vacuum Interrupters[J].Siemens Forsch U Entwickl Ber,1988,17:105-111. |
[4] | 王亚平 .选相强化及组织超细化对CuCr触头材料电性能的影响[D].西安:西安交通大学,1998. |
[5] | Rieder W F;Schussek M;Glatzle W et al.Influence of Composition and Cr Particle Size of CuCr Contacts on Chopping Current,Contact Resistance,and Breakdown Voltage in Vacuum Interrupters[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1989,12(02):273-283. |
[6] | Frey F;Klink N;Michal R et al.Metallurgical Aspects of Contact Materials for Vacuum Switch Devices[J].IEEE Transactions on Plasma Science,1989,17(05):734-740. |
[7] | 周武平;吕大铭 .[J].高压电器,1995,2:44-46. |
[8] | 杨志懋 .合金元素、显微组织对真空触头材料耐电压强度、分断电流能力和截流值的影响[D].西安:西安交通大学,1996. |
[9] | Ding B J;Yang Z M;Wang X T .Influence of Microstructure on Dielectric Strength of CuCr Contact Materials in a Vacuum[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1996,19A(01):76-81. |
[10] | Seki T;Yamamoto Y;Okutom T A.Metallurgical Study of CuCr Contact Surface in Breakdown[A].Nagoya,1994:879-886. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%