采用热压成型工艺,制备了一种低损耗ZrTi2O6陶瓷填充聚四氟乙烯(PTFE)的新型微波复合基板材料.采用介质谐振器法研究了ZrTi2O6/PTFE复合材料的微波介电性能(8～12 GHz).结果表明,ZrTi2O6/PTFE复合材料的相对介电常数(εr)和介电损耗(tanδ)随着ZrTi2O6陶瓷体积分数(0～46％)的增加而增大,介电常数实验值与Lichtenecker模型预测值最吻合.ZrTi2O6/PTFE复合材料的热膨胀系数和介电常数温度系数随着ZrTi2O6陶瓷体积分数的增加而减小.46％的ZrTi2O6为较优填料比例,ZrTi2O6/PTFE的相对介电常数为7.42,介电损耗为0.0022(10 GHz).
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