以PMDA和ODA为单体原料、DMF为溶剂、TEOS为有机硅源,采用溶胶-凝胶法制备了PI/SiO2杂化薄膜,测试了杂化薄膜的透光率和隔热性能;采用FT-IR、SEM、TG-DTA等分析手段对杂化薄膜的结构、微观形貌及热稳定性进行了表征.结果表明,杂化薄膜的可见光透过率高于85%,紫外光透过率低于10%.隔热性能测试结果显示,杂化薄膜具有良好的隔热性能.结构分析证明,热处理后生成了聚酰亚胺环,形成了有机相-无机相互穿结构.热重分析表明,掺杂SiO2的薄膜失重5%的温度升高了24℃.
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