Solder joint reliability is one of critical problems detemining whether Sirface Mount Technology (SMT) can be used in the prohotion of important electronic products. Optimizing solder joint shape is one of effective ways to improve SMT solder joint reliability.In this paper. based on the theorem of minimum potential energy, an energy model of 3 - D solder joint shape is established,and the forma- tion of solder joint is numerically simulated by Surface Ecolver program. On the basis of the prediction of SMT solder joint shape,the mechanical model of analyzing solder joint reliability is established. An elasto - plasto - creep mateial model and its mechanical constitutive equaton are established for SnPb solder alloy, and the stress/strain response of SMT solder joint under thermal cyclical loabing is ana- lyzed with nonlinear 3 - D FEM. The fatigue life of solder joint is predicted according to Coffin- Manson fatigue life model. An integrated system for Predicting and analyzing SMT solder joint shape and reliability(PSAR) is developed.The system can analyze efficiently SMT solder joint reliability with the variation of structural parameters in the joint and give the optimal structure.
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