氮化铝具有良好的热学、电学和机械等性能,是理想的电子封装材料和高性能陶瓷基板材料.本文论述了目前国内外氮化铝陶瓷粉体的主要制备方法及其特点,分析了氮化铝粉体制备的主要影响因素,阐述了主要解决措施,展望了氮化铝陶瓷粉体制备技术研究发展的方向.
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