采用元素粉作为原料,通过热等静压技术(HIP)制备出50％ SiP/Al-Cu和70％SiP/Al-Cu(体积分数)复合材料,研究固溶处理和峰值时效处理对复合材料显微组织、Al2Cu相溶解过程及力学性能的影响.结果表明:热等静压技术制备的SiP/Al-Cu复合材料完全致密,组织均匀细小,材料由Si相、Al相和Al2 Cu组成,白色Al2Cu相产生于原始的Cu粉与Al粉界面处.在516℃固溶处理2h后,70％ SiP/Al-Cu复合材料中的Al2Cu相全部溶入Al基体中,而50％ SiP/Al-Cu复合材料中还残留少量Al2Cu相.经过峰值时效处理后,50％ SiP/Al-Cu和70％ SiP/Al-Cu复合材料的抗弯强度为548 MPa和404 MPa,相对于热等静压态分别提高了38.81％和13.51％,复合材料的强度显著增强.
参考文献
| [1] | Jacobson D M.Spray-formed silicon-aluminum[J].Advanced Materials and Processes,2000,157(3):36-39. |
| [2] | Ye Haizhi.An overview of the development of Al-Si-alloy based material for engine applications[J].Journal of Materials Engineering and Performance,2003,12(3):288-297. |
| [3] | Xiu Ziyang,Chen Guoqin,Wang Xiaofeng,Wu Gaohui,Liu Yanmei,Yang Wenshu.Microstructure and performance of Al-Si alloy with high Si content by high temperature diffusion treatment[J].Science Direct,2010,20(11):2134-2138. |
| [4] | Dayanand M G,Rudrakshi G B,Srivastav V C,Jagannath R,Ajith G J.Spray deposition process of hypereutectic Al-Si alloys:An overview[J].International Journal of Scientific & Engineering Research,2011,6(2):1-9. |
| [5] | 田荣璋.铸造铝合金[M].长沙:中南大学出版社,2006:40.Tian Rongzhang.Aluminum casting alloy[M].Changsha:Central South University Press,2006:40. |
| [6] | Jacobson D M,Ogilvy A J W.Spray-deposited Al-Si (Osprey CE) alloys and their properties[J].Materialwissenschaft and Werkstofftechnik,2003,34(4):381-384. |
| [7] | 李超,彭超群,余琨,王日初,杨军,刘溶.喷射沉积70％Si-Al合金电子封装材料的组织与性能[J].中国有色金属学报,2009,19(2):303-307.Li Chao,Peng Chaoqun,Yu Kun,Wang Richu,Yang Jun,Liu Rong.Microstructure and properties of spray deposition of 70％Si-Al alloy for electronic packing applications[J].The Chinese Journal of Nonferrous Metals,2009,19 (2):303-307. |
| [8] | 王晓峰,赵九州,田 冲.喷射沉积制备新型电子封装材料70％Si-Al的研究[J].金属学报,2005,41(12):1277-1279.Wang Xiaofeng,Zhao Jiuzhou,Tian Chong.Study of novel electronic packaging material 70％ Si-Al prepared by the spray deposition[J].Acta Metallurgica Sinica,2005,41 (12):1277-1279. |
| [9] | KimSC,KimM T,Lee S,Chung H,AhnJ H.Effects of copper addition on the sintering behavior and mechanical properties of powder processed Al/SiCP composites[J].Journal of Materials Science,2005,40(2):441-447. |
| [10] | Zhou J,Duszczyk J.Liquid phase sintering of an AA2014 based composite prepared from an elemental powder mixture[J].Journal of Materials Science,1999,34(3):545-550. |
| [11] | Zhang Qi,Xiao Bolü,Liu Yue,Ma Zhongyi.Microstructureevolution and elemental diffusion and elemental diffusion of SiCP/Al-Cu-Mg composites prepared from elemental powder during hot pressing[J].Journal of Materials Science,2011,46(21):6783-6793. |
| [12] | Lasa L,Rodriguez-Ibabe J M.Characterization of the dissolution of the Al2Cu phase in two Al-Si-Cu-Mg casting alloys using calorimetry[J].Materials Characterization,2002,48(5):371-378. |
| [13] | Gupta M,Lavernia E J.Effect of processing on the microstructural variation and heat-treatment response of a hypereutectic Al-Si alloy[J].Journal of Materials Processing Technology,1995,54(1/4):261-270. |
| [14] | Takeda M,Madea Y,Yoshida A,Yabuta K,Konuma S,Endo T.Discontinuity of G.P.zone and θ"-phase in an Al-Cu alloy[J].Scripta Materialia,1999,41(6):643-649. |
| [15] | Wyss R K,Sanders R E.Microstructure-property relationship in a 2xxx aluminum alloy with addition[J].Metallurgical and Metallurgical Transactions A,1988,19(10):2523-2530. |
| [16] | 赵敏,武高辉,姜龙涛,孙东立.高体积分数挤压铸造铝基复合材料时效特征[J].复合材料学报,2004,21(3):91-95.Zhao Min,Wu Gaohui,Jiang Longtao,Sun Dongli.Aging characteristics of a high volume fraction SiCP/LD2 composite[J].Acta Materiae Compositae Sinica,2004,21(3):91-95. |
| [17] | Arsenault R J,Wang L,Feng C R.Strengthening of composites due to microstructural changes in the matrix[J].Acta Metallurgica et Materialia,1991,39(1):47-57. |
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