对Sn--3.0Ag--0.5Cu无铅体钎料和Sn--4.0Ag--0.5Cu无铅钎料BGA(ball grid array)焊点进行了Berkovich纳米压痕法实验,通过改变不同的加载速率研究了钎料的蠕变特征。钎料压痕载荷－位移曲线蠕变部分表现出了明显的加载速率相关性。基于Oliver--Pharrr法确定的体钎料和BGA焊点的Young's模量分别为9.3和20 GPa.基于压痕做功概念确定的体钎料和BGA焊点的应变速率敏感指数分别为0.1111和0.0574。钎料的力学性能有着明显的尺寸效应。
Berkovich nanoindentation tests with different loading rates have been performed on the Sn--3.0Ag--0.5Cu bulk solder and Sn--4.0Ag--0.5Cu lead--free ball grid array (BGA) solder joint. The load--depth curves are rate dependent. The Young's modulus of bulk solder and BGA joint obtained from load--depth curves with Oliver--Pharr method are 9.3 and 20 GPa respectively. The creep rate sensitivity of bulk solder and BGA joint obtained from curves with the concept of “work of indentation” are 0.1111 and 0.0574 respectively. The mechanical properties of Sn--Ag--Cu lead-free solder are typically size dependent.
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