分别在空气和循环水冷条件下对2024-T4铝合金板进行搅拌摩擦焊接(friction stir welding,FSW),研究了水冷介质对FSW接头组织性能的影响.结果表明:循环水冷介质具有明显的瞬时快冷作用,水冷介质下FSW可以显著细化晶粒,并抑制焊核区析出相的生长,焊核区的平均晶粒尺寸达到700 nm,析出相尺寸达到30~200 nm.水冷介质减弱了FSW接头的热软化效应,改善了接头的组织和性能,使焊核区HV显微硬度值提高了234 MPa,接头抗拉强度提高了52.2 MPa,但试样延伸率有所下降.
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