以水为介质,NH3*H2O为催化剂,丙三醇(C3H5(OH)3和聚乙烯醇(PVA)为添加剂,正硅酸乙脂(TEOS)溶胶-凝胶工艺可制备纳米多孔二氧化硅薄膜.体系的H2)/TEOS＞15,TEOS的水解-聚合过程可通过添加剂效应,pH效应等控制.碱催化会使二氧化硅的溶解度增大,也能使二氧化硅胶粒带负电荷,抑制了二氧化硅胶粒之间的聚合长大,而丙三醇与TEOS的水解中间Si(OR)4-x(OH)x结合,抑制其与二氧化硅胶粒的聚合.聚乙烯醇(PVA)能使二氧化硅溶胶具有网状结构,使二氧化硅溶胶易于成膜.该工艺制备的多孔二氧化硅薄膜具有纳米多孔结构.其Vicker硬度在600～800N/mm2,热导率＜0.2w@m-1 K-1.
参考文献
| [1] | Gignac LM.;Chandrashekhar GV.;Parrill TM. .POROUS SIO2 FILMS ANALYZED BY TRANSMISSION ELECTRON MICROSCOPY[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1995(1/2):59-63. |
| [2] | Zhang JF.;Groeseneken G.;Al-kofahi IS. .Behavior of hot hole stressed SiO2/Si interface at elevated temperature[J].Journal of Applied Physics,1998(2):843-850. |
| [3] | Husing N;Schubert U;Airy A .[J].Angewandte Chemie International Edition,1998,37 22 |
| [4] | Balagopal N Nair;Yamaguchi T;Okubo T et al.[J].Journal of Membrane Science,1997,135:237. |
| [5] | Zhao Dongyuan;Feng Jianglin;Huo Qisheng et al.[J].Science,1998,279:548. |
| [6] | Trau M;Yao N;Kim Y E et al.[J].Nature,1997,390:674. |
| [7] | Dubrovinsky L S;Saxena S K;Lazor O et al.[J].Nature,1997,388:362. |
| [8] | Stephen D Kinrade;Jefrey W Delnin;Andrew S Schach et al.[J].Science,1999,285:1542. |
| [9] | Lu Yunfeng;Ganggull R;Celeste A Drwien et al.[J].Nature,1997,389:364. |
| [10] | watton R et al.[J].红外,2000,8:1. |
| [11] | Xu Y Q;Wu N J;Lgnatiev A .[J].Journal of Applied Physics,2000,88(02):1004. |
| [12] | Sai S Prakash;Jeffrey Brinker C;Alan J Hurd .[J].NATURE,1995,374:439. |
| [13] | Boonstra A H;Bken J M E .[J].Journal of Non-Crystalline Solids,1989,109:1. |
| [14] | Donatti DA.;Vollet DR.;Ruiz AI. .From sol to aerogel: a study of the nanostructural characteristics of TEOS derived sonogels[J].Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites,2001(1/3):44-49. |
| [15] | James C Wang .[J].Journal of Materials Science,1984,19:805. |
| [16] | Lambropoulos J C;Jolly M R;Amsden C A et al.[J].Journal of Applied Physics,1989,66(09):4230. |
| [17] | Lee SM.;Cahill DG. .HEAT TRANSPORT IN THIN DIELECTRIC FILMS[J].Journal of Applied Physics,1997(6):2590-2595. |
| [18] | Morrow G D .[J].Ceramic Bulletin,1979,58:687. |
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