为了能使绝缘基材高效、低成本地实现线路的金属化，制备了一种含银的化学镀铜活化浆料，将其涂在PET（聚对苯二甲酸乙二酯）薄膜上再进行化学镀铜。通过红外光谱、扫描电镜（SEM）以及结合力、导电性、开路电位-时问曲线测量等分析了活化浆料的分子结构以及化学镀铜过程中试样的表面形貌、性能，并探讨了活化浆料的催化机理等。结果表明：Ag^＋与聚氨酯树脂主链-NHCOO-基团中的N，O形成配位键；化学镀铜过程先得到离散均匀的铜颗粒，随时间延长最终得到均匀致密的铜层；银含量越大，缓慢生成铜活性中心的诱导时间越短，浆料活性越高；该工艺可得到结合力、导电性良好的电路图案，可在全印制电子技术中推广应用。
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