研究了电化学酸洗对镀锡板孔隙率的影响.采用X射线荧光光谱仪(XRF)、扫描电子显微镜(SEM)、金相显微镜、原子力显微镜(AFM)等对原板表面成分、形貌以及锡的电沉积层形貌进行了表征,并测试了镀锡板的孔隙率.结果表明:随着酸洗时间的延长,原板表面富集的锰元素含量减少,铁晶粒暴露程度增大,电沉积的锡晶粒逐渐细化,镀锡板孔隙率降低.
The effect of electrochemical pickling on the porosity of tin plate was studied. The composition and morphology of black plate and the morphology of tin plate were characterized by X-ray fluorescence (XRF), metalloscope, scanning electron microscopy (SEM) and atomic force microscopy (AFM). The porosity (PHG value) of tin plate was also tested. It was found that the content of enriched Mn on the surface of black plate is decreased, the exposure degree of Fe crystal grain increased, the electro-deposited tin crystal grain refined and the porosity of tin plate reduced with increasing pickling time.
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