采用拉开法分析了KH550（γ-氨丙基三乙氧基硅烷）偶联剂浓度对Parylene C膜与金属铝基体间结合强度的影响,采用拉曼光谱（Raman）和红外光谱（FT-IR）分析了偶联剂在膜和基体间的作用机理。研究结果表明,使用10%的KH550偶联剂可提高Parylene C膜与铝基体的结合强度到7.5MPa。其增强作用机理为KH550偶联剂的烷氧基团水解后,-Si-OH与基体的Al-O键发生化学作用生成-Si-O-Al键,-NH2能与Parylene C膜分子间形成氢键,从而使Parylene C膜与金属铝之间产生化学键桥连。
Gama-amino-propyl-triethoxy-silane （named as KH550） was used as the surface treatment agent to improve the bonding strength d Poly（2-chloro-para-xylylene） （known as Parylene C） thin film to aluminium substrate. The effect on improving the bonding strength of Parylene C film to aluminium substrate surface was investigated. The mechanism was proposed by analyzing the chemical structures of the KH550 between aluminium substrate and Parylene C film. It is found that bonding strength of Parylene C film to the aluminium substrate is improved to 7.5MPa after surface treatment with 10 % KH550 silane mlution, due to the interaction of the silanol group with the aluminium oxide and the formation of the hydrogen bonds between - NH2 in KH550 and Cl - C- in Parylene C film.
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