研究了工艺参数对Ta/Cu真空扩散焊的影响.利用扫描电镜(SEM)、能谱分析(EDS)、显微硬度等测试方法对结合面微区进行了分析.结果表明:采用真空扩散焊工艺,在焊接压力为10 MPa及焊接时间为60 min的工艺参数下,界面孔洞随着焊接温度的升高而减少,在焊接温度达到1000℃时,结合面内孔洞基本消失,结合面扩散区域宽度为3～5 μm;加工硬化导致硬度升高,焊合区的硬度值要比未焊合区的硬度值稍高.
参考文献
| [1] | Wang Dayong;Gu Xiaolong.[J].Journal of Zhejiang Metallurgy,2007(04):1. |
| [2] | Yao Lijun;Wang Xueze;Liu Qing .[P].China Patent,CN101518851A,2009. |
| [3] | Ichiroh Sawamura;Shuichi Irumata .ADVANCED TECHNOLOGY FOR TANTALUM SPUTTERING TARGETS[J].Tantalum-Niobium International Study Center,2003(114):2-5. |
| [4] | Xiao Jia;Zheng Weixing .[J].Journal of Hunan University of Science andEngineering,2007,28(12):47. |
| [5] | Li Yajiang;Wu Huiqiang;Chen Mao'ai et al.[J].The Chinese Journal of Nonferrous Metals,2001,11(03):424. |
| [6] | Zhou Fangming;Qian Yiyu;Zhang Jing et al.[J].Transactions of the China Welding Institution,2006,27(06):41. |
| [7] | Fang Hongyuan;Feng Jicai.Interface Behavior during Material Joining Process[M].哈尔滨:哈尔滨工业大学出版社,2005:125. |
| [8] | Frederick A Schmidt;John D Verhoeven;Edwin D Gibson .[P].United States Patent,4600448,1986. |
| [9] | Wu Y E;Lo Y L .[J].Theoretical and Applied Fracture Mechanics,2002,38(01):71. |
| [10] | Zuruzi A S;Li H;Dong G .[J].Materials Science and Engineering A,1999,270(02):244. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%