利用射频磁控溅射技术,在生长了Ta缓冲层的石英玻璃衬底上采用不同溅射功率下制备了一系列的硅薄膜样品,用拉曼光谱和X射线衍射表征了薄膜的结晶性随溅射功率的变化情况.实验结果表明:随着溅射功率的增加,薄膜逐渐由非晶向微晶过渡,晶粒沿Si(311)面呈柱状生长,功率升高到80 W时薄膜的晶化率达到75.4%,薄膜为典型的微晶结构.继续增加功率,薄膜的结晶性变差,晶化率下降,在60~120 W之间存在一个优化理想的射频溅射功率,在此功率下生长的薄膜样品的结晶性最高.本文还尝试解释了Ta缓冲层在Si晶化过程中的作用.
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