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The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere (H_2 5%+Ar 95%). Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film.At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.

参考文献

[1] D. W. Zheng;Weijia Wen;K. N. Tu .In situ scanning electron microscopy study of eutectic SnPb and pure Sn wetting on Au/Cu/Cr multilayered thin films[J].Journal of Materials Research,1999(3):745-749.
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