采用硅胶对制备的HAP晶须进行表面改性形成SiO2颗粒附着,然后以硅胶改性的HAP晶须为填料混合甲基丙烯酸酯制备复合树脂材料.二氧化硅对晶须改性是通过形成凝胶颗粒与晶须结合并通过热处理形成牢固的结合.通过XRD、FT-IR光谱和SEM以表征微结构、键性质以及表面相组成.结果表明:经硅胶改性的HAP晶须表面有SiO2小颗粒附着,随着煅烧温度的增加,SiO2颗粒的数量明显增多,尺寸有变大的趋势.复合树脂材料的弯曲强度随改性晶须煅烧温度的增加而增加,以600 ℃煅烧的改性晶须为原料制备的树脂样品,其弯曲强度最高,达到89.46 MPa.
HAP whiskers were prepared and surface modified via silicon Sol which formed SiO2 particles on the whisker , then the surface modified HAP whiskers were mixed into methacrylate ester to prepare resin composite.Silica modification relied on the silica sol which forms droplets of gel combined with whisker on the surfaces and forming a strong bond via heat treatment.XRD patterns, FT-IR spectroscopy and SEM were applied in order to character the micro-structure and bond nature as well as the surface phase composition.It is shown that SiO2 particles adhered on the surfaces of HAP whiskers, raising the calcination temperature significantly increased the amounts of SiO2 particles as well as the particle size.The bending strength of the resin material is increased following the raising of calcining temperature treated on modified whiskers.The resin sample prepared by the raw material of HAP whiskers calcined at 600 ℃obtained the highest bending strength, which measured 89.46 MPa.
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