欢迎登录材料期刊网

材料期刊网

高级检索

利用脉冲电沉积制备细晶镍镀层。研究了糖精对镍镀层的晶粒尺寸、表面形貌、晶体取向和硬度的影响。结果表明:加入糖精后,可获得晶粒尺寸小于30nm的镍镀层,晶体择优取向由(200)织构向(111)织构转变,镀层的耐蚀性得到提高;镀层的硬度与镍镀层的晶粒尺寸有关,晶粒尺寸较大时,服从Hall—Petch关系,晶粒尺寸较小时产生纳米效应,反Hall—Petch关系。

参考文献

[1] 杨建明,朱荻,雷卫宁.电沉积法制备纳米晶材料的研究进展[J].材料保护,2003(04):1-4.
[2] Bakonyi I;Tath-kadar E;Pogamy L et al.Preparation characterization of d.c.-plated nanocrystalline nickel elec-trodeposits[J].Surface and Coatings Technology,1996,78(01):124-136.
[3] Pavlatou EA;Raptakis M;Spyrellis N .Synergistic effect of 2-butyne-1,4-diol and pulse plating on the structure and properties of nickel nanocrystalline deposits[J].Surface & Coatings Technology,2007(26):4571-4577.
[4] E1-Sherik A M;Erb U .Synthesis of bulk nanocrystalline nickel by pulse electrodeposition[J].Journal of Materials Science,1995,30(22):5743-5747.
[5] Moiler A;Hahn H .Synthesis and characterization of nano-rystalline Ni/ZrO2 composite coatings[J].Nanostruct Ma-ter,1999,12(01):259-262.
[6] 熊毅,荆天辅,张春江,邵光杰,于升学,张芳,张春玲.喷射电沉积纳米晶镍的研究[J].电镀与精饰,2000(05):1-4.
[7] Qu NS.;Zhu D.;Chan KC.;Lei WN. .Pulse electrodeposition of nanocrystalline nickel using ultra narrow pulse width and high peak current density[J].Surface & Coatings Technology,2003(2/3):123-128.
[8] 邓姝皓,龚竹青,陈文汩.电沉积纳米晶体材料的研究现状与发展[J].电镀与涂饰,2001(04):35-39,50.
[9] Chen C J;Wan C C .A Study of the current efficiency de-crease accompanying short pulse time for pulse plating[J].Journal of the Electrochemical Society,1989,136:2850-2855.
[10] Kh. M. S. Youssef;C. C. Koch;P. S. Fedkiw .Influence of Additives and Pulse Electrodeposition Parameters on Production of Nanocrystalline Zinc from Zinc Chloride Electrolytes[J].Journal of the Electrochemical Society,2004(2):C103-C111.
[11] Puippe J C;Ibl N .Influence of charge and discharge of electric double layer in pulse plating[J].Journal of Applied Electrochemistry,1980,10(06):775-784.
[12] Kim W;Weil R .Pulse plating effects in nickel electrodepo-sition[J].Surface and Coatings Technology,1989,38(03):289-298.
[13] Kostin N A;Krivtsov A K;Abdulin V S et al.Mechanism of brightening of nickel coatings in pulsed electrolysis[J].Soviet Electrochemistry,1982,18(02):185-188.
[14] Kaja S;Pickering H W;Bider W R .Effect of pH on the microstructure of nickel electrodeposits:A TEM study[J].Plating and Surface Finishing,1988,75(01):58-61.
[15] Abdulin V S;Chemenko V I .Current yield and mechanical properities of nickel deposited in pulsed conditions[J].Plot Met (English translation of Zaschita Metallov),1982,18(06):777-779.
[16] EI-Sherik A M;Erb U;Page J .Microstructural evolution in pulse plated nickel electrodeposits[J].Surface and Coatings Technology,1996,88(1-3):70-78.
[17] Choo RTC.;Elsherik AM.;Erb U.;Toguri JM. .MASS TRANSFER AND ELECTROCRYSTALLIZATION ANALYSES OF NANOCRYSTALLINE NICKEL PRODUCTION BY PULSE PLATING[J].Journal of Applied Electrochemistry,1995(4):384-403.
[18] White R E;Conway B E;Vayenas C G.Modem Aspects of Electrochemistry[M].New York:Plenum,1973
[19] 葛福云.糖精对电沉积镍的结构与电化学活性的影响[J].厦门大学学报,1994(02):182.
[20] E1-Sherik A M;Erb U;Palumbo G et al.Deviations from Hall-Petch Behavior in As-Prepared Nanoerystalline Nickel[J].Scripta Metallurgica et Materialia,1992,27(09):1185-1188.
[21] Gleiter H .Nanostructured materials scientific background and technological perspectives[J].Materials Science Forum,1995,189/ 190:67-80.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%