采用硅烷偶联剂乙烯基三甲氧基硅烷(A-171)对杨木单板进行预处理,然后与高密度聚乙烯(HDPE)薄膜复合制备胶合板.研究了A-171对板材物理力学性能的影响,利用红外光谱、X射线光电子能谱及扫描电镜探讨了界面增容的机理.结果表明,经过A-171处理后,板材的胶合强度和耐水性都有所改善,当偶联剂用量为2％时处理效果最好,胶合强度达到1.8 MPa,比未处理材的胶合强度增加128％,木破率也由10％提高到99％.胶合板的24 h吸水率(WA)和吸水厚度膨胀率(TS)分别降低了28％和42％.通过X射线光电子能谱、红外光谱和扫描电镜分析可知,A-171成功在杨木单板表面发生了接枝反应,有效地改善了单板与HDPE的界面相容性.
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