材料期刊网

水垢对铜板的导热能力有较大影响，本文利用扫描电镜和X衍射仪对结晶器水冷侧沉积物进行了分析研究，发现沉积物中的元素主要为氧、铜、铁、镍等。结晶器水冷侧表面的沉积物覆盖不均匀，厚度差别较大，沉积物与铜基体的结合非常紧密。为避免结晶器铜板表面出现沉积物，在生产中应严格按照软化水的水质要求，并添加性能满足要求的阻垢缓蚀剂。

Scale deposit has great effect on heat conduction ability of mold copper plate. Deposition on cooling side of mold was analyzed by means of SEM and diffraction instrument in laboratory, and we discovered main element in deposition, such as oxygen, copper, iron, nickel etc. It was non-uniform on the surface of copper plate and had obvious difference of thickness, combined compactly with copper plate. In order to prevent existence of deposition, requirement of water quality should be observed strictly during production, and the substance having suitable properties used to prevent deposition and corrosion should be added into cooling water.