采用不同于桐油酸酐胶黏剂且具有较高热变形温度的黏合剂制备了JF5440-1G高机械强度多胶粉云母带，对该云母带的常规性能进行了研究。结果表明，该云母带固化后在155℃下的弯曲强度不低于100 MPa，在50~120℃其导热系数为0.31~0.32 W/(m·K)，各项性能均达到IEC 60371-3-6技术指标要求。
A JF5440-1G high mechanical strength resin-rich mica tape was prepared using an epoxy adhe-sive which had high heat distortion temperature and was different from tung oil-bismaleimide-maleic anhy-dride, and its basic conventional properties were investigated. The results show that the flexural strength at 155 ℃ of the cured mica laminate is no less than 100 MPa, the thermal conductivity is between 0.31 W/(m·K) and 0.32 W/(m·K) from 50℃ to 120℃, and various properties can meet the technical re-quirements of IEC 60371-3-6.
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