电子行业的快速发展对二层型挠性覆铜板的性能提出了更高的要求，针对以聚酰亚胺薄膜为基底材料的二层型挠性覆铜板，分别从改善粘结性能、介电性能和耐热性能3个方面综述了二层型挠性覆铜板的研究进展，并展望了二层型挠性覆铜板的研究方向。
The fast development of electronic industry puts forward higher requirements for the property of flexible copper clad laminate (FCCL). The research progress of two-layer type FCCL, which using polyimide film as substract, was reviewed from improving the adhesive property, dielectric property and heat resistance, and the research directions of two-layer type FCCL were proposed.
参考文献
| [1] | Jiru Meng;Guozheng Liang;Lei Zhao .Study on epoxy matrix modified with poly(2,6-dimethyl-1,4-phenylene ether) for application to copper clad laminate[J].Composites science and technology,2002(6):783-789. |
| [2] | Hong C K;Hwang I;Kim N et al.Mechanical Properties of Silanized Jute-polypropylene Composites[J].Journal of In-dustrial and Engineering Chemistry,2008,14(01):71-76. |
| [3] | 杨培发,严辉,范和平.二层柔性覆铜板用聚酰亚胺研究进展[J].绝缘材料,2006(03):27-31,35. |
| [4] | YU J.;SHIN T.J.;WANG X.;CAI W.;ZHOU D.;LEE K.-W. .Miscibility of Polyimide with Polymeric Primer and It s Influence on Adhesion of Polyimide to the Primed Copper Metal: Effect of Precursor Origin[J].Journal of Polymer Science, Part A. Polymer Chemistry,1999(19):2806-2814. |
| [5] | 庄永兵,顾宜.改善无胶型挠性覆铜板粘接性能的研究进展[J].绝缘材料,2012(01):25-29. |
| [6] | Bogert M T;Renshaw R R .4-Amino-o-phthalic Acid and Some of Its Derivatives[J].Journal of the American Chemi-cal Society,1908,30(07):1135-1144. |
| [7] | Edwards M W;Roginson L M .Polyimides of Pyromellitic Acid[P].US,2710853,1955-06-14. |
| [8] | Inoue H.;Ogawa T.;Sasaki Y. .COMPARISON OF ONE-POT AND TWO-STEP POLYMERIZATION OF POLYIMIDE FROM BPDA/ODA[J].Journal of Applied Polymer Science,1996(1):123-131. |
| [9] | Harris F W;Hsu S C .Synthesis and Characterization of Polyimides Based on 3,6-Diphenylpyromellitic Dianhydride[J].High Performance Polymers,1989,1(01):3-16. |
| [10] | 辜信实.用于挠性覆铜板的聚酰亚胺膜[J].印制电路信息,2004(04):17-20. |
| [11] | 任小龙,董占林,张俊丽,张俊杰.国外聚酰亚胺薄膜产品及应用进展[J].绝缘材料,2013(03):28-32. |
| [12] | 祝大同.挠性PCB用基板材料的新发展（1）--FCCL发展的综述与特点[J].印制电路信息,2005(02):7-13. |
| [13] | 余凤斌,陈莹,夏祥华,朱德明.二层型聚酰亚胺薄膜挠性覆铜板的制备与分析[J].绝缘材料,2008(04):6-8. |
| [14] | 张翔宇,梁立,茹敬宏,伍宏奎,刘生鹏,鹿海华.二层法双面挠性覆铜板的研制[J].绝缘材料,2009(06):9-11. |
| [15] | 杨培发,严辉,范和平.二层柔性覆铜板用聚酰亚胺研究进展[J].绝缘材料,2006(03):27-31,35. |
| [16] | 牛新星 .新型聚酰亚胺聚合物的合成及其与铜箔的粘结机理研究[D].中山大学,2009. |
| [17] | Strunskus T;Grunze M;Kochendoerfer G et al.Identifica-tion of Physical and Chemical Inter-action Mechanisms for the Metals Gold,Silver,Copper,Palladium,Chromium,and Potassium with Polyimide Surfaces[J].LANGMUIR,1996,12(11):2712-2725. |
| [18] | Yongqing Huang;John J. McCormick;James Economy .Adhesion of an aromatic thermosetting copolyester with copper foils[J].Polymers for advanced technologies,2005(1):1-5. |
| [19] | Kun Xu;James Economy .Hyperbranched Thermosetting Poly(imide-ester): Synthesis and Properties[J].Macromolecules,2004(11):4146-4155. |
| [20] | Haight R;White R C;Silverman B D et al.Complex For-mation and Growth at the Cr-and Cu-Polyimide Interface[J].Journal of Vacuum Science Technology A,1988,6(04):2188-2199. |
| [21] | White R C;Haight R;Silverman B D et al.Cr-and Cu-Polyimide Interface:Chemistry and Structure[J].Applied Physics Letters,1987,51(07):481-483. |
| [22] | 中国电子学会生产技术学会分会专家.挠性印制板生产技术[M].中国香港:香港盈拓科技咨询服务有限公司,2004 |
| [23] | Dong-Hee Park;Won-Kook Choi .Low energy O_2~+ and N_2O~+ ion beam modification of polyimide for improving adhesive strength of Cu/PI in roll-to-roll process[J].Thin Solid Films,2009(14):4222-4225. |
| [24] | Chang G S;Jung S M;Lee Y S et al.Adhesion Enhance-ment of Ion Beam Mixed Cu/Al/Polyimide[J].Journal of Applied Physics,1997,81(01):135-138. |
| [25] | Yang CH;Lee SC;Wu JM;Lin TC .The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2005(5):1818-1825. |
| [26] | Soo-Min HWANG,Jun-Hyung LIM,Chang-Min LEE,Eui-Cheol PARK,Jun-Hyuk CHOI,Jinho JOO,Hoo-Jeong LEE,Seung-Boo JUNG.Fabrication of two-layer flexible copper clad laminate by electroless-Cu plating on surface modified polyimide[J].中国有色金属学报（英文版）,2009(04):970-974. |
| [27] | Bo-In Noh;Jeong-Won Yoon;Bo-Young Lee;Seung-Boo Jung .Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni-Cr)/PI interfaces in flexible printed circuits[J].Journal of Materials Science. Materials in Electronics,2011(7):790-796. |
| [28] | Inagaki N;Tasaka S;Onodera A .Improved Adhesion be-tween Kapton Film and Copper Metal by Silane-coupling Reactions[J].Journal of Applied Polymer Science,1999,73(09):1645-1654. |
| [29] | Chen H L;Ho S H;Wang T H et al.Curl-free High-ad-hesion Polyimide/Copper Laminate[J].Journal of Applied Polymer Science,1994,51(09):1647-1652. |
| [30] | Hwa Jin Kim;Yun Jun Park;Jong-Ho Choi .Surface modification of polyimide film by coupling reaction for copper metallization[J].Journal of industrial and engineering chemistry,2009(1):23-30. |
| [31] | 王劲,唐屹,曾晓丹,王剑,谢美丽.一种挠性印制电路基板的研制[J].电子元件与材料,2007(02):34-36. |
| [32] | 刘书祯.印制电路板用铜箔的表面处理[J].电镀与精饰,2008(02):17-20,23. |
| [33] | 徐树民,杨祥魁,刘建广,宋召霞,陈晓鹏.挠性印刷电路板用超低轮廓铜箔的表面处理工艺[J].电镀与涂饰,2011(07):28-33. |
| [34] | 蔡积庆.FPC用电解铜箔--HL铜箔[J].印制电路信息,2005(06):21-23,52. |
| [35] | 余德超,谈定生,郭海亮,韩月香,赵为上,王勇,范君良.压延铜箔电镀Zn-Ni合金工艺研究[J].电镀与精饰,2007(06):16-19. |
| [36] | Chang-Yong Lee;Jae-Hong Lee;Don-Hyun Choi;Hoo-Jeong Lee;Hyoung-Sub Kim;Seung-Boo Jung;Won-Chul Moon .Effects of nodule treatment of rolled copper on the mechanical properties of the flexible copper-clad laminate[J].Microelectronic engineering,2007(11):2653-2657. |
| [37] | 余德超,谈定生,王松泰,郭海亮,韩月香,王勇,范君良.印制板用压延铜箔镀铜粗化工艺[J].电镀与涂饰,2007(10):33-35,44. |
| [38] | Jung H. Kim;Kwang H. Baek;Chang Kyung Kim;Young Bae Kim;Chong Seung Yoon .Formation of gold nanoparticles embedded in a polyimide film for nanofloating gate memory[J].Applied physics letters,2007(12):123118-1-123118-3-0. |
| [39] | Tilford T;Bailey C;Parrott A.Impact of Assembly Process Technologies on Electronic Packaging Materials[A].,2008:1-6. |
| [40] | Long T;Swager T .Molecular Design of Free Volume as a Route to Low-K Dielectric Materials[J].Journal of the American Chemical Society,2003,125(46):14113-14119. |
| [41] | G.Maier .Low dielectric constant polymers for microelectronics[J].Progress in Polymer Science,2001(1):3-65. |
| [42] | Ghaemy M;Berenjestanaki F R;Bazzar M .Organosoluble,Thermally Stable and Low Dielectric Constant Fluorinated Polyimides Containing 2,4,5-triphenylimidazole Moiety in the Main Chains[J].Designed Monomers and Polymers,2014,17(02):101-110. |
| [43] | Leu CM.;Reddy GM.;Wei KH.;Shu CF. .Synthesis and dielectric properties of polyimide-chain-end tethered polyhedral oligomeric silsesquioxane nanocomposites[J].Chemistry of Materials,2003(11):2261-2265. |
| [44] | Leu CM.;Chang YT.;Wei KH. .Polyimide-side-chain tethered polyhedral oligomeric silsesquioxane nanocomposites for low-dielectric film applications[J].Chemistry of Materials,2003(19):3721-3727. |
| [45] | Zhang, H.;Li, J.;Tian, Z.;Liu, F. .Synthesis and properties of novel alicyclic-functionalized polyimides prepared from natural-(D)-camphor[J].Journal of Applied Polymer Science,2013(6):3333-3340. |
| [46] | Dumitru Popovici;Camelia Hulubei;Vasile Cozan .Polyimides containing cycloaliphatic segments for low dielectric material[J].High performance polymers,2012(3):194-199. |
| [47] | Kohei Goto;Mayumi Kakuta;Yasutake Inoue;Minoru Matsubara .Low Dielectric and Thermal Stable Polyimides with Fluorene Structure[J].Journal of Photopolymer Science and Technology,2000(2):313-316. |
| [48] | Korshak V V;Vinogradova S V;Vygodskii Y S et al.Car-do Polymers[J].Journal of Macromolecular Science Part C Polymer Reviews,1974,11(01):45-142. |
| [49] | Masatoshi Hasegawa;Azumi Tominaga .Fluorene-Containing Poly(ester imide)s and their Application to Positive-Type Photosensitive Heat-Resistant Materials[J].Macromolecular materials and engineering,2011(11):1002-1017. |
| [50] | Yuan Y;Lin BP;Zhang XQ;Wu LW;Zhan Y .Nonfluorinated copolymerized polyimide thin films with ultralow dielectric constants[J].Journal of Applied Polymer Science,2008(3):1515-1519. |
| [51] | Wang X M;Liu F;Lai J C et al.Comparative Investiga-tions on the Effects of Pendent Trifluoromethyl Group to the Properties of Polyimides Containing Diphenyl-substitut-ed Cyclopentyl Cardo-structure[J].Journal of Fluorine Chemistry,2014,164:27-37. |
| [52] | 杨进,周雪松,詹怀宇,胡健,顾宜,刘向阳.苯并（噁）唑侧基聚酰亚胺的制备与性能[J].高分子材料科学与工程,2009(10):124-127. |
| [53] | 鲁东奎,曾科,武迪蒙,李黎,高帅,郭乔,林淦,杨刚.含苯并噁唑侧基可溶性聚酰亚胺的合成与性能[J].塑料工业,2011(04):24-26,73. |
| [54] | John A M .Aromatic Polyamides and Polyimides with Benzimidazole or Benzoxazinone Pendent Groups Prepared from 5-(2-benzimidazole)-or 5-(2-benzoxazinone)-l,3-pheny-lenedi-amine[J].POLYMER,1996,37(13):2715-2721. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%