本文根据概率理论和金属扩散焊接过程中焊接面上原子激活的特点,建立了接合面上原子成键反应的数学模型,从而给出了焊接工艺参数和材料参数对接合强度的影响规律,模型中采用了界面上原子反应激活中心是界面位错及其弹性应力场的假设。文中以7075Al合金扩散焊接实验为基础,对模型进行了定量计算,计算结果与实验结果基本一致。
According to probabilty theory and atomic activation on bonding interface of metals, a mathematical model was developed for the atomic interfacial reaction during diffustion bonding. The effect of parameters of bonding processing and material on the bonding strength was then gained. It was suggested that the activation centre of atomic interfacial reac-tion of bonding may be, in situ, the boundary dislocaion and its elastic stress field. A substantial agreement about the quantitative prediction of the model was made with the results of diffusionbonding experiments for 7075 Al alloy
参考文献
| [1] | |
| [2] |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%