采用粉末冶金-熔渗法制备了不同TiC添加量的CuW合金.研究了添加TiC对CuW材料静态性能、真空电击穿性能及显微组织的影响.结果表明:TiC的添加量在0～1.2%(质量分数,下同)时,随着添加量的增加,合金的硬度逐渐升高,而电导率变化不大;当添加量在1.2%～2.0%范围内时,硬度和电导率则大幅下降.添加TiC相提高了CuW材料的耐电压强度,降低了截流值.对真空电击穿后的表面组织形貌分析发现,由于TiC相在钨骨架上的钉扎作用,铜液的飞溅较小;电击穿发生在Cu/TiC相界面上,且击穿坑较小.
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