采用反应连接的方法实现了反应烧结碳化硅(RB-SiC)之间以及反应烧结碳化硅和重结晶碳化硅(R-SiC)之间的连接.分别在光学显微镜、扫描电镜上观察了连接区的显微组织和断口形貌,并用弯曲强度和电阻率评价了反应粘接硅/碳化硅材料接头的机械和电性能.研究结果表明,反应连接可以使母材间形成良好的接合界面,连接层未对整体材料的强度和电阻率造成明显的影响.接合区组织和成分的优化是获得碳化硅材料优异连接性能的关键.
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