对Sn-3.5Ag-0.7Cu/Ni-P界面上的焊点进行了150℃固相老化和250℃液相回流老化实验. 两种条件下焊料体内和界面处金属间化合物的成分、长大速率及形貌均有较大差异. 在液相回流条件下金属间化合物长大更快, 对焊点的可靠性有较大的影响. 延长固相老化时间, 焊点内生成大尺寸的Ag3Sn相; 高温液相回流有Ni3P层生成, 降低焊点的焊接强度.
Intermetallic compounds (IMC) near the interfaces of solder joints has significant effects on joint reliability. In this paper, 150 oC aging and high temperature reflow of Sn-3.5Ag-0.7Cu solder joints on Ni-P/Cu were performed. For two aging processes, the IMC growth, morphologies, compositions and their effect on joint reliability were studied. The results indicate that the IMC morphologies and compositions in condition of 150 oC aging were much different from that in condition of reflow. Long time 150 oC aging results in large clusters of Ag3Sn IMC in solder. Brittle Ni3P layer was found after high temperature reflow, which was absent in long time 150 oC aging.. Under both conditions, ternary Ni-Cu-Sn IMCs were observed between solder interfaces. The morphologies, compositions and thickness of IMC affected the strength of solder joints.
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