采用动力学Monte Carlo方法模拟动力学控制条件下电沉积多晶镍薄膜的生长.研究了表面扩散对电镀薄膜微观结构的影响.模拟结果显示,溶液温度和沉积速率是2个非常重要的参数,它们能改变吸附原子的扩散能力,因而对薄膜的晶粒尺寸、相对密度、表面粗糙度等微观结构产生显著影响.此外,还得到该模式下薄膜的生长因子,大约为0.46.
A kinetic Monte Carlo technique is adopted to simulate the growth process of electrodeposited polycrystalline Ni films on kinetically limited conditions. Effects of the surface diffusion on the microstructures of the plated films such as shape and size of grains, relative density and surface roughness are examined. Results show that the electrolyte temperature and the deposition rate are very important parameters which can change the diffusion ability of the adatoms to strongly influence the microstructures of the films. In additional, the growth exponent β is obtained, valued at 0. 46 approximately.
参考文献
| [1] | Trahey L;Becker CR;Stacy AM .Electrodeposited bismuth telluride nanowire arrays with uniform growth fronts[J].Nano letters,2007(8):2535-2539. |
| [2] | Nielsch K.;Li AP.;Gosele U.;Muller F. .Uniform nickel deposition into ordered alumina pores by pulsed electrodeposition[J].Advanced Materials,2000(8):582-586. |
| [3] | Hyde M E;Compton R G .A review of the analysis of multiple nucleation with diffusion controlled growth[J].Journal of Electroanalytical Chemistry,2003,549:1. |
| [4] | Farkas D;Mohanty S;Monk J .Linear grain growth kinetics and rotation in nanocrystalline Ni[J].Physical review letters,2007(16):5502-1-5502-4-0. |
| [5] | Shah Z W et al.Grain boundary-mediatedplasticity in nanocrystalline nickel[J].Science,2004,305:651. |
| [6] | Williamson M J;Tromp R M;Vereecken P M et al.Dynamic microscopy of nanoseale cluster growth at the solidliquid interface[J].Nature Materials,2003,2:532. |
| [7] | Radisic A;Vereecken PM;Hannon JB;Searson PC;Ross FM .Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data[J].Nano letters,2006(2):238-242. |
| [8] | Scharifker B;Hills G .Theoretical and experimental studies of multiple nucleation[J].Electrochimica Acta,1983,28:879. |
| [9] | Milchev A;Heerman L .Electrochemical nucleation and growth of nano-and microparticles:some theoretical and experimental aspects[J].Electrochimica Acta,2003,48:2903. |
| [10] | Guo L;Radisic A;Searson P C .Kinetic Monte Carlo simu-lations of nucleation and growth in electrodeposition[J].Journal of Physical Chemistry B,2005,109:24008. |
| [11] | Drews TO;Aleksandar R;Erlebacher J;Braatz RD;Searson PC;Alkire RC .Stochastic simulation of the early stages of kinetically limited electrodeposition[J].Journal of the Electrochemical Society,2006(6):C434-C441. |
| [12] | Stephens RM;Alkire RC .Simulation of kinetically limited nucleation and growth at monatomic step edges[J].Journal of the Electrochemical Society,2007(8):D418-D426. |
| [13] | Leger C;Elezgaray J;Argoul F .Experimental demonstration of diffusion-limited dynamics in electrodeposition[J].Physical review letters,1997(26):5010-5013. |
| [14] | Castro M.;Sanchez A.;Dominguez-Adame F.;Cuerno R. .Multiparticle biased diffusion-limited aggregation with surface diffusion: A comprehensive model of electrodeposition[J].Physical review.E.Statistical physics, plasmas, fluids, and related interdisciplinary topics,2000(1 Pt.a):161-173. |
| [15] | Tan X;Zhou Y C;Zheng X J .Pulsed-laser deposition of polycrystalline Ni films:A three-dimension kinetic Monte Carlo simulation[J].Surface Science,2005,588:175. |
| [16] | Wonchoba S E;Hu W P;Truhlar D G .Surface diffusion of H on Ni(100):Inerpretation of the transition temperature[J].Physical Review B,1995,51:9985. |
| [17] | Yang Y G et al.A Monte Carlo simulation of the physical vapor deposition of nickel[J].Acta Materials,1996,45:1455. |
| [18] | Goods S H;Kelly J J;Talin A A et al.Electrodeposition of Ni from low-temperature sulfamate electrolytes[J].Journal of the Electrochemical Society,2006,153(05):C325. |
| [19] | Lafourease M C;Heard P J;Schwarzacher W .Anomalous scaling for thich electrodeposited films[J].Physical Review Letters,2007,98:236101. |
| [20] | Timothy J. Pricer;Mark J. Kushner;Richard C. Alkire .Monte Carlo Simulation of the Electrodeposition of Copper[J].Journal of the Electrochemical Society,2002(8):C406-C412. |
| [21] | Family F;Vicsek T .Scaling of the active zone in the Eden process on percolation networks and the ballistic deposition model[J].Journal of Physics A,1985,18:L75. |
| [22] | Sarma S D;Tamborenea P .A new universality class for kinetic growth:one-dimension molecular-beam epitaxy[J].Physical Review Letters,1991,66:325. |
| [23] | Pal S;Landau S P .Monte Carlo simulation and dynamic scaling of surfaces in MBE growth[J].Physical Review B,1994,49:10597. |
| [24] | M. Saitou;W. Oshikawa;M. Mori .Surface Roughening in the Growth of Direct Current or Pulse Current Electrodeposited Nickel Thin Films[J].Journal of the Electrochemical Society,2001(12):C780-C783. |
| [25] | Ernst H J;Fabre F;Folkerts R et al.Observation of a growth instability during low temperature molecular beam epitaxy[J].Physical Review Letters,1994,72:112. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%