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目的：优化电感器线圈电镀工艺，研究电感线圈电镀过程中电流、电解质电势和镀层厚度分布规律。方法采用计算机仿真技术，基于电镀动力学、电化学理论、法拉第定理和移动网格理论，建立电感线圈匝数参数化的三维电感器线圈电镀模型。结果电感线圈外部的铜离子浓度较高，大约为309 mol/ m3。电感线圈最外圈的电镀厚度最厚，约7.3141μm。线圈外部较大的电流导致电镀线圈外侧出现较大的沉积速率。结论电解的铜离子的质量传递是影响电镀动力学的最主要因素，线圈电镀层厚度与电镀活性面上的电流分布相互作用。该电镀模型可用于分析线圈匝数对电镀工艺的影响，优化设计类似电镀工艺，研究电镀机理。

Objective To optimize the electroplating process of the inductor coil and study the current distribution, the electro-lyte potential and the coating thickness distribution during the electroplating process of the inductor coil. Methods The computer simulation technology was used to build a three-dimensional inductor coil plating model with regards to parameterized coil turns based on plating kinetics, electrochemistry theory, Faraday theorem, and moving mesh model. Results The external part of induc-tor had a high copper concentration of about 309 mol/ m3; the outermost plating inductor coil had the highest thickness of about 7. 3141 μm; the larger current in the external coil resulted in a larger plating deposition rate for the outer coil. Conclusion The mass transfer of electrolytic copper ion has the main effect on the plating kinetics. The plating thickness interacts with the current distribution on the active plating surface. The plating model can be used to analyze the impact of different plating turns on the plat-ing process, the optimization design of similar electroplating process and the study of electroplating mechanism.