为了全面了解热处理温度对Cr—C—Cu电镀层性能的影响，分别使用XPS，XRD，MH-5．VM显微硬度仪和SRV-IV微动摩擦磨损试验机考察了不同热处理温度下镀层的形貌、成分、硬度及磨损性能。结果表明：三价铬镀铬液中掺入铜离子更易获得平整均匀的镀层；Cr—C-Cu镀层镀态及其200oC热处理后的主要物相为非晶相，400℃热处理后的主要物相为具有面心立方Cu（fCCCu）晶格的Cr-Cu固溶体合金相，600oC热处理后的Cr—C—Cu镀层中的主要物相转变为具有体心立方Cr（bCCCr）晶格的Cr．Cu固溶体合金相；Cu原子在Cr—C—Cu镀层中以金属键的形式存在；Cr—C-Cu镀层镀态时具有最佳的抗磨损性能，随着热处理温度升高，抗磨损性能呈先降后升的趋势，经400℃热处理后的镀层抗磨性最差；Cr—C—Cu镀层在镀态和经不同温度热处理后的抗磨性能均优于同样条件下的Cr—C镀层。
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